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bonding and integrated systemsBonding and Integrated Systems

Watlow provides precision elastomeric bonding and assembly integration capabilities for critical components in wafer processing tools. Specialized tooling and innovative bond methods enable superior control over dimensional characteristics and material properties. Watlow also applies elastomeric material expertise to custom molding solutions, both for assembly integration and as stand-alone coatings, seals and gaskets.

Contact your Watlow semiconductor representative for more information.